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Micro/Nano Fabrication and Cleanroom

The MRL Micro/Nanofabrication Facility is a multidisciplinary, user-supported facility providing equipment and resources for thin film deposition and the fabrication of patterned micro-and nano-sized structures on flexible and other multi-layer electronic devices.The facility operates a 1,400 square foot, class-100 cleanroom with instrumentation for wet/chemical etching, spin coating, mask aligners, and general optical and 3D printing lithography. The facilities also include an on-site mask fabrication service and an additional 500 square foot class-100 cleanroom with an electron-beam lithography system capable of 20-nm line resolution for pattern delineation and device fabrication.

Cleanroom

The MicroFab cleanroom is used for a wide range of micro and nano-fabrication projects. In addition to UIUC researchers, the cleanroom allows outside academic users as well as users from industry.  Learn more about the MRL Cleanroom >>

Techniques

Deposition Tools

The facilities include a variety of tools for thin-film and multi-layered structure fabrication using electron-beam and thermal evaporators, sputtering and atomic layer deposition methods. We provide the deposition sources and targets but in many cases users can work with staff to add their sources for their own, specific materials.

Lithography

Lithography uses light or electron beam to produce specific patterns on substrates during device fabrication. Photo- and electron-beam lithography facilities are available in the MRL through a series of mask aligners, stampers, ovens, two-photon sub-micron lithography 3D printing and an electron-beam lithography system.

Wet Processing

Wet processing work in the MRL Cleanroom is supported by several fume hoods and flow benches for processes involving acids, solvent developer, and metal etchants.

Dry Etching

Dry etching is a key step in device fabrication where layers or selected areas of material are removed by employing a plasma of reactive gases. The MRL offers several dry etching tools applicable to a variety of layers and substrate types and sizes.

Furnace Equipment

Several furnaces covering a variety of temperature ranges under vacuum or various ambient conditions are available to carry out diffusion processes, dopant activation, ion-implantation damage repair, fabrication of graphene or carbon nanotubes, etc.

Bonding Stations

Probe Stations

Additional Micro/Nanofabrication Resources



Equipment in this Core

Equipment Name Contact Location Techniques
Equipment Name Contact Location Techniques
Heidelberg MLA150 aligner for maskless photolithography jeffg 388 MRL
  • Lithography

This instrument eliminates the need of photomasks during photolithography since the design file is exposed directly on to the resist-coated wafer via a two-dimensional spatial light modulator.

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Westbond 4KE wire bonder frao taoshang 326 MRL
  • Bonding Stations

Wire bonding is a method of connecting metallic wires to electronic devices. The wire bonds are performed using ultrasonic transducers that convert a high frequency electronic signal to mechanical energy in the ultrasonic range (63kHz).

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SCS Labcoter2 Parylene Coater frao 326 MRL
  • Deposition Tools

The SCS Labcoter2 Parylene deposition system performs reliable and repeatable Parylene conformal coatings to many different types of components such as circuit boards, sensors, wafers, medical devices, MEMS and elastomeric components. Parylene coatings provide a highly effective chemical and moisture barrier with high dielectric and mechanical strength.

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Graphene Furnace – Max Temp. 1050°C frao 322 MRL
  • Diffusion / Annealing Furnaces

The Graphene Furnace is solely dedicated to the growth of high-quality graphene and carbon nanotube materials.

 

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Hydrogen Vacuum Furnace – Max Temp. 1000°C frao 322 MRL
  • Diffusion / Annealing Furnaces
  • Furnace Equipment

The Hydrogen Vacuum Furnace is dedicated to annealing of materials under hydrogen and vacuum environment.

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AJA E-beam evaporator 1 taoshang frao 348 MRL
  • Deposition Tools

AJA E-beam evaporator 1 has an electron beam gun assembly with six source crucibles.

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AJA Orion-8 Sputtering System for Magnetic Materials frao taoshang 336 MRL
  • Deposition Tools
Raith eLine electron Beam Lithography System taoshang 364 MRL
  • Lithography

Raith eLine EBL system is an electron beam lithography system that has a ZEISS SEM column equipped with a Thermal Field Emission electron gun. The accelerating voltage can be operated at 10 - 30kV. It is capable of patterning ultra fine features with resolution down to 10 nm in PMMA ebeam resist. It has a standard 30 μm aperture along with 7.5 up to 120 µm aperture. Standard write field size is 100 μm and ranges between 1µm to 1 mm. Field stitching error is typically less than 40 nm. Standard sample holder can accommodate up to 5” wafer. Eight sample clips can be used for smaller sample with sample size from 1 to 3 cm. GDSII CAD file is standard file format and can be converted from other CAD files such as Autocad DXF file.

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Harrick Plasma Oxygen Cleaner xlwang84 326 MRL
  • Dry Etching

The Harrick Plasma PDC-32G Cleaner is low-cost bench-topinductively coupled plasma device. It may be employed in a broad range of surface engineering applications, including nanoscale surface cleaning, surface preparation and surface modification/treatment.

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Temescal Ebeam Evaporator 2 taoshang 348 MRL
  • Deposition Tools

Temescal Ebeam evaporator 2 has an electron beam gun assembly with six manually selected source crucibles. Currently approved deposition materials are metals only including Ag, Cu, Cr, Ti, Al, Ni, Fe, Si, Ge. The maximum thickness of a single layer is limited to 200 nm. 13 4-inch wafers or sample holders can be accommodated in the loadlock chamber for line-of-sight deposition. Deposition rate and thickness of material are monitored. Power of ebeam for deposition is controlled manually by user.

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Temescal Ebeam Evaporator 4 taoshang 348 MRL
  • Deposition Tools

Temescal Ebeam evaporator 4 has an electron beam gun assembly with six automatically selected source crucibles. Currently approved deposition materials are metals only including Au, Ag, Pt, Pd, Cu, Cr, Ti, Ni, Fe, Al. The maximum thickness of a single layer is limited to 300 nm. Thirteen 4-inch wafers or sample holders can be accommodated in the loadlock chamber for line-of-sight deposition. Deposition rate and thickness of material are monitored and controlled automatically. The system is fully automated with computer interface. Programmable deposition recipes are provided.

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AJA Orion 3 Sputter Coater 2 taoshang frao 326 MRL
  • Deposition Tools

AJA sputter coater 2 is an AJA ORION 3 sputter system with three ST20 ORION magnetron sputter guns capable of sputtering conductive and dielectric materials using DC and RF Argon plasma. Co-sputtering (up to three guns, two DC and one RF power supply) is available. The system accommodates 2” targets (1/4” thick) including various materials such as Cr, Ti, Cu, Mo, Al, Ag, Pt, Pd, Mg, Ni, Fe, Co, Si, Ge, W, ITO, SiO2, Si3N4 and MgO. Sample holder size is 4” in diameter. Reactive sputtering with O2 is available.

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AJA ATC2000 Sputter Coater 1 taoshang frao 336 MRL
  • Deposition Tools

AJA sputter coater 1 is an AJA ATC 2000 sputter system with four A320 XP UHV magnetron sputter guns capable of sputtering conductive and dielectric materials using DC and RF Argon plasma. Co-sputtering (up to three guns, two DC and one RF power supply) is available. The system accommodates 2” targets (1/4” thick) including various materials such as Cr, Ti, Cu, Mo, Al, Ag, Mg, Ni, Fe, Co, Si, Ge, W, ITO, SiO2, Si3N4 and MgO. Sample holder size is 4” in diameter. Substrate heating is available at up to 400 C. Reactive sputtering with O2 and N2 is also available.

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Optical Microscopes with CCD cameras frao taoshang 326 MRL
  • Additional Micro/Nanofabrication Resources
Jandel 4-Point Probe Sheet Resistance Measurement frao taoshang,jeffg 326 MRL
  • Additional Micro/Nanofabrication Resources

- Automatically calculate and display sheet resistance results - Self test against external precision resistor, 100Ω - Output currents up to 99.99mA and down to 10nA - Compliance voltage up to 40V - Accuracy of the instrument within 1% across whole range.

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4155c Semiconductor Parameter Analyzer (Agilent), used with Lake Shore and custom probe station frao 326 MRL
  • Probe Stations
Bench Top Probe Station (Custom) frao taoshang 326 MRL
  • Probe Stations
Temperature-Controlled Cryogenic Vacuum Probe Station frao 326 MRL
  • Probe Stations

The LakeShore FWPX Cryogenic Probe Station is a great characterization tool for taking electrical measurements in a temperature range from ~ 10 K (when using liquid Helium) or 77 K (when using liquid Nitrogen) up  to 475 K, and in a vacuum environment down to 10-5 Torr. The electrical signals are taken through the Agilent 4155C Semiconductor Parameter Analyzer which has 4 SMU units with a voltage output range of -100 to 100 V and a current output range of  -100 to 100 mA. Users can perform temperature-dependent measurements of I-V and C-V curves, and other high and low frequency tests.

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Wedge Bonder (25 um Aluminum wire, K&S 4523A) frao 326 MRL
  • Bonding Stations
Ball Bonder (25 um Gold wire, K&S 4524A) frao taoshang 326 MRL
  • Bonding Stations
Rapid Thermal Annealing furnace (Custom) – max temperature 1000°C frao 328 MRL
  • Diffusion / Annealing Furnaces
  • Furnace Equipment

Rapid Thermal Annealing furnace (Custom) – max temperature 1000°C

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High Temperature CM furnace – max temperature 1600°C frao 328 MRL
  • Diffusion / Annealing Furnaces
  • Furnace Equipment

High Temperature CM furnace – max temperature 1600°C

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Reactor Vacuum Furnace (RVF) frao lonw 322 MRL
  • Furnace Equipment

Reactor Vacuum Furnace - 1” tube furnace for recording pressure, temperature, vacuum, and reaction products at up to 1200°C

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6" Tube oxidation furnace frao 328 MRL
  • Diffusion / Annealing Furnaces
  • Furnace Equipment

6" Tube oxidation furnace – max temperature 1100°C

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MJB4 Mask Aligner jeffg taoshang 313 MRL
  • Lithography
MJB3 Mask Aligner jeffg taoshang 313 MRL
  • Lithography

The Karl Suss MJB-3 Mask Aligner is designed for high resolution photolithography. The MJB-3 offers flexibility in the handling of irregular shaped substrates and pieces of differing thickness, as well as mask sizes of 3x3 inches. Geometries as small as 1.5 microns can be achieved using the 365 Nanometer wavelength illumination.

 

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Nanoscribe Photonic Professional GT 3D Printer jeffg 335 MRL
  • Lithography

The next generation 3D laser lithography system, MRL’s Nanoscribe sets new standards in 3D micro printing and maskless lithography.

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Solvent Fume Hood or Developer Fume Hood xlwang84 384 MRL
  • Wet Processing

The solvent or developer fume hoods include DI water, nitrogen gun and ultrasonic bath.

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Metal Etchant Fume Hood xlwang84 387 MRL
  • Wet Processing

MRL provides the following metal etchants for cleanroom users: - Copper Etchant CE-100 - Chromium Etchant 9057 - Iron Oxide Mask Etchant ME-9028 - Gold Etchant Type TFA

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Acid Fume Hood xlwang84 359 MRL
  • Wet Processing

MRL provides the following acids for cleanroom users. This fume hood includes DI water, nitrogen gun and hot plate.

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Commonwealth Scientific Ion Milling & Thermal Evaporator System frao taoshang,xlwang84 334 MRL
  • Dry Etching

The Commonwealth Scientific Ion Milling & Thermal Evaporator System is a unique system which integrates the ion milling and thermal evaporator capabilities into one system.

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Nordson March Reactive Ion Etch (RIE) Plasma System 1 & 2 xlwang84 taoshang,jeffg 342 MRL
  • Dry Etching

March CS-1701 reactive ion etcher is a bench-top system with water cooled RF platen. It is capable of etching photoresist, polymer and graphene. This system could be operated under manual mode or auto mode.

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Nano-Master Reactive Ion Etch (RIE) Plasma System xlwang84 taoshang 342 MRL
  • Dry Etching

Nano-master NPC 3000 is a bench-top Reactive Ion Etching (RIE) system with showerhead gas distribution and water cooled RF platen. It is designed to meet a wide range of needs including sample cleaning, photoresist stripping, surface modification, polymer etching and silicon etching. The chamber opens from the top for wafer loading or unloading. It can accept up to 8" (200 mm) wafers.

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Plasma-Therm 790 MF Reactive Ion Etch (RIE) Plasma System xlwang84 taoshang 342 MRL
  • Dry Etching

Plasma-therm 790 MF is a stand-alone Reactive Ion Etching (RIE) system with showerhead gas distribution and water cooled RF platen. The chamber could reach a base pressure in the 3x10-5Torr range, and it can be operated in the pressure range of 10mTorr to 100mTorr. The following gases are installed: CF4, CHF3, SF6 and O2.The flow rate for each gas is set by a mass-flow controller (MFC), and the pressure is controlled separately by a throttle valve between the chamber and the pump. All system functions are controlled from the computer. The control program has both manual and automatic modes.

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AJA Orion-8 Magnetron Sputtering System frao taoshang 336 MRL
  • Deposition Tools

This equipment was funded through the Illinois MRSEC, NSF Award Number DMR-1720633

The AJA Orion-8 Magnetron Sputtering System is a high performance thin film deposition tool meant to deliver maximum performance and results for our research community. The system is equipped with a fast-cycle load-lock system which eliminates the need to vent the process chamber to load substrates, reducing the pump down time and contaminations of targets and interior chamber surfaces. It utilizes a motorized rotating substrate holder to achieve excellent uniformity. This machine is featured with complete recipe control to deliver best process reproducibility.

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Savannah S100 Atomic Layer Deposition Cambridge Nanotech frao taoshang,xlwang84 326 MRL
  • Deposition Tools

The Savannah S100 ALD systems deliver outstanding deposition results and provide maximum experimental flexibility for ALD research, development, and production applications.

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Plasma-Therm Plasma Enhanced Chemical Vapor Deposition System (PECVD) xlwang84 taoshang 342 MRL
  • Deposition Tools

Plasma-Therm plasma enhanced chemical vapor deposition (PECVD) system is used for depositing Si3N4 dielectric films. The silicon nitride film is typically used for capacitor dielectrics, chemical passivation layers, electrical insulators, reactive ion etching masks, and optical anti-reflective coatings.

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Kurt J. Lesker Nano36 Thermal Evaporator System xlwang84 taoshang 326 MRL
  • Deposition Tools

The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-sit by a thickness monitor. Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination.Currently the system is configured for Au, Ag, Cu and Cr evaporation. Due to the limited capacity of tungsten boat and rod, the thickness limit is 200nm/boat for Au, Ag, Cu, and 40nm/rod for Cr.

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Yield Engineering Vacuum Curing Ovens jeffg 328 MRL
  • Lithography
Yield Engineering HMDS Vapor Prime Oven-Cleanroom jeffg 388 MRL
  • Furnace Equipment
  • Lithography
Headway PWM32 Wafer Spin Coater jeffg 388 MRL
  • Lithography
Oriel Re-Exposure Unit jeffg 387 MRL
  • Lithography
Lindberg Three Zone Two Inch (L3Z2I) frao lonw 328 MRL
  • Furnace Equipment

Lindberg Three Zone 2 Inch - Tube oxidation/annealing furnace – max temperature 1100°C

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