The Grainger College of Engineering
Materials Research Laboratory

Facilities News

Temporary Tools/Lab Closures During the MRL Plumbing Repair Project

Updated 01/07/2026:

12/8-12/26 (stack 8):

  • MRL 331 (staff office): CLOSED.
  • Non-facilities labs also closed during this period: MRL C192, MRL B-09, MRL 141, MRL 145, MRL 147, MRL 231, MRL 233, MRL 417, MRL 433, MRL 488 .

1/9/2026-1/29/2026 (stack 11):

  • MRL 387 (cleanroom metal etch room): CLOSED. All tools in this room NOT AVAILABLE. 
  • MRL 337 (fab waste room): CLOSED. All tools in this room NOT AVAILABLE.
  • MRL 355 (fab utilities room): CLOSED. All tools in this room NOT AVAILABLE.
  • Non-facilities labs also closed during this period: MRL 49, MRL 147, MRL 153, MRL 159, MRL 241, MRL 255, MRL 439, MRL 485.

1/30/2026-2/16/2026 (stack 12):

  • MRL 148 (x-ray lab and 1st floor LSF lab): CLOSED. All tools in this room NOT AVAILABLE. 
  • MRL 342 (fab RIE's and PECVD lab): CLOSED. All tools in this room NOT AVAILABLE.
  • Non-facilities labs also closed during this period: MRL 49,  MRL 242, MRL 244, MRL 248,  MRL 442, MRL 444, MRL 448.

We apologize for the inconvenience, but this project is crucial for our building infrastructure.

Please plan your work accordingly and visit this page for more updates.

If you have questions, don't hesitate to contact us.

Thank you for your understanding and support of the MRL shared facilities.

Research Facilities News

Upcoming Tool for the MRL Research Facilities

Kurt J. Lesker 150LX Plasma Enhanced Atomic Layer Deposition System

The Kurt J. Lesker Company (KJLC) ALD150LX is an Atomic Layer Deposition (ALD) system designed specifically for advanced research and development (R&D) applications. With an emphasis on enabling and supporting innovative, cutting-edge technology at the R&D level, the ALD150LX serves not only as a stand-alone platform, but provides connectivity with additional process and analysis modules in a cluster tool configuration.  ALD150LX cluster tool connectivity eliminates unwanted atmosphere exposure between critical process and analysis steps to protect sensitive surfaces, layers and their interfaces. This connectivity includes the integration of additional ALD and analysis modules, as well as other KJLC thin film deposition technologies for multi-technique process and analysis capability and support that are second-to-none in the industry. Combined quality, flexibility and performance, as well as multi-technique process and analysis capability make the ALD150LX an innovative, best-in-class design.

Kurt J. Lesker 150LX Plasma Enhanced Atomic Layer Deposition System

Features:

  • Process wafers up to 6-inch in diameter.
  • Controllable independent substrate heater stage (up to 600oC)
  • Unique Perpendicular Flow Reactor
  • Thermal or plasma-enhanced ALD configuration
  • In-situ ellipsometry for real time thin film thickness monitoring
  • Multiple inlets for precursor delivery (up to 12 precursor sources)
  • Unique heater design on source modules 
  • control software

Typical Processes:

Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZrO2, HZO, ZnO, AZO, AIN, TiN, GaN Pt and Ru (many others available, please inquire).

Expected fall 2025. Micro/NanoFab Core, MRL. Installation in progress.