The Grainger College of Engineering
Materials Research Laboratory

Facilities News

TEMPORARY TOOLS/LAB CLOSURES DURING THE MRL PLUMBING REPAIR PROJECT:

Updated 5/7/2025:

4/25-5/29 (vent/pipes stack 16):

  • MRL B60: Utility room - CLOSED but pumps and chillers in this utility room will be operating normally.
  • MRL B62: All EM prep tools CLOSED, but access to the DETEM in MRL B64 will be open. Plasma cleaner and pump station will be moved to room MRL B56 and will be AVAILABLE. DETEM in MRL B64 AVAILABLE.
  • MRL 362: Eline EBL and Raith prep room – LAB CLOSED. (4/11 – 5/29)
    MRL 364: EBL gowning area closed but access to EBPG EBL system will be open. EBPG EBL system AVAILABLE. (4/11 – 5/29)

5/19-5/23:

  • MRL B80: CLOSED for ceiling repair, therefore Keyence 3D optical profiler and Dektak stylus profilometer NOT AVAILABLE.

5/12-6/3 (vent/pipes stack 17):

  • MRL B01: CLOSED, CAMECA Atom Probe Tomography system NOT AVAILABLE.
  • MRL B67 (utilities room): CLOSED 5/12-7/2.
  • MRL B70: CLOSED, Logitech lapping/polishing system NOT AVAILABLE.
  • MRL 359 (cleanroom acid etching room): CLOSED 5/12 – 7/2.

6/4-7/2 (vent/pipes stack 18):

  • MRL B59 (EM prep, glovebox, ion mills, bio service prep): CLOSED, all tools in this room NOT AVAILABLE. The PECS ion beam polisher system will be moved to MRL 130 during this period and it will be AVAILABLE.
  • MRL B67 (utilities room): CLOSED 5/12-7/2.
  • MRL 359 (cleanroom acid etching room): CLOSED 5/12 – 7/2.
  • MRL 387 (cleanroom metal etching room): CLOSED.

7/3-7/28 (vent/pipes stack 19):

  • MRL B80: CLOSED for ceiling repair, therefore Keyence 3D optical profiler and Dektak stylus profilometer NOT AVAILABLE.
  • MRL 380 (shared staff office): CLOSED.
  • MRL 384 (cleanroom sample cleaning and developing): CLOSED.

 

UPCOMING TEMPORARY CLOSURES IN THE MRL FAB CLEANROOM:

The ongoing plumbing and venting pipe replacement project in the MRL building will impact cleanroom access from May 11th to July 29th.  Room closures and alternative arrangements are outlined below:

  • Room 359: Closed from May 11th to July 3rd.
    • HF/BOE process available in Room 387.
    • For nanostrip and other acid processes, please contact staff for alternative solutions.
    • May 12th - June 2nd:
    • June 2nd - July 3rd: All acid processes (including HF/BOE, nanostrip, and others) will be unavailable in the cleanroom.
  • Room 387: Closed from June 3rd to July 3rd.
    • Metal etchant processes unavailable during this period.
  • Room 384: Closed from July 2nd to July 29th.
    • Use the Raith prep room for sample cleaning and developing during this period.
    • If you do not have i-card access to the Raith prep room, please submit a key request for Rooms 364 and 362 online. https://my.mrl.illinois.edu/keys/request
  • Rooms 388 and 313: Closure dates TBD; updates forthcoming.

We apologize for the inconvenience, but this project is crucial for our building infrastructure.

Please plan your work accordingly and visit https://mrl.illinois.edu/facilities/research-cores/facilities-news for more information.

If you have questions, don't hesitate to contact us.

Thank you for your understanding and support of the MRL shared facilities.

 

 

RESEARCH FACILITIES NEWS:

 

UPCOMING TOOL FOR THE MRL RESEARCH FACILITIES:

Kurt J. Lesker 150LX Plasma Enhanced Atomic Layer Deposition System

The Kurt J. Lesker Company (KJLC) ALD150LX is an Atomic Layer Deposition (ALD) system designed specifically for advanced research and development (R&D) applications. With an emphasis on enabling and supporting innovative, cutting-edge technology at the R&D level, the ALD150LX serves not only as a stand-alone platform, but provides connectivity with additional process and analysis modules in a cluster tool configuration.  ALD150LX cluster tool connectivity eliminates unwanted atmosphere exposure between critical process and analysis steps to protect sensitive surfaces, layers and their interfaces. This connectivity includes the integration of additional ALD and analysis modules, as well as other KJLC thin film deposition technologies for multi-technique process and analysis capability and support that are second-to-none in the industry. Combined quality, flexibility and performance, as well as multi-technique process and analysis capability make the ALD150LX an innovative, best-in-class design.

Features:

  • Process wafers up to 6-inch in diameter.
  • Controllable independent substrate heater stage (up to 600oC)
  • Unique Perpendicular Flow Reactor
  • Thermal or plasma-enhanced ALD configuration
  • In-situ ellipsometry for real time thin film thickness monitoring
  • Multiple inlets for precursor delivery (up to 12 precursor sources)
  • Unique heater design on source modules 
  • control software

Typical Processes:

Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZrO2, HZO, ZnO, AZO, AIN, TiN, GaN Pt and Ru (many others available, please inquire).

Expected early spring 2025. Micro/NanoFab Core, MRL.