Deposition Tools
The facilities include a variety of tools for thin-film and multi-layered structure fabrication using electron-beam and thermal evaporators, sputtering and atomic layer deposition methods. We provide the deposition sources and targets but in many cases users can work with staff to add their sources for their own, specific materials.
Note: Maximum deposition thickness for all E-beam systems is 300 nm. In Ebeam 3, special depositions with film thickness > 300 nm and < 1 μm may be allowed only when approved by Staff. There might be an additional surcharge in these cases.
Deposition Tools Equipment
| Equipment Name | Contact | Location | |
|---|---|---|---|
| Equipment Name | Contact | Location | |
| SCS Labcoter2 Parylene Coater |
|
348 MRL |
The SCS Labcoter2 Parylene deposition system performs reliable and repeatable Parylene conformal coatings to many different types of components such as circuit boards, sensors, wafers, medical devices, MEMS and elastomeric components. Parylene coatings provide a highly effective chemical and moisture barrier with high dielectric and mechanical strength. |
| AJA E-beam evaporator 1 |
|
348 MRL |
AJA E-beam evaporator 1 has an electron beam gun assembly with six source crucibles. |
| AJA Orion-8 Sputtering System for Magnetic Materials |
|
336 MRL | |
| Temescal Ebeam Evaporator 2 |
|
348 MRL |
Temescal Ebeam evaporator 2 has an electron beam gun assembly with six manually selected source crucibles. Currently approved deposition materials are metals only including Ag, Cu, Cr, Ti, Al, Ni, Fe, Si, Ge. The maximum thickness of a single layer is limited to 200 nm. 13 4-inch wafers or sample holders can be accommodated in the loadlock chamber for line-of-sight deposition. Deposition rate and thickness of material are monitored. Power of ebeam for deposition is controlled manually by user. |
| Temescal Ebeam Evaporator 4 |
|
348 MRL |
Temescal Ebeam evaporator 4 has an electron beam gun assembly with six automatically selected source crucibles. Currently approved deposition materials are metals only including Au, Ag, Pt, Pd, Cu, Cr, Ti, Ni, Fe, Al. The maximum thickness of a single layer is limited to 300 nm. Thirteen 4-inch wafers or sample holders can be accommodated in the loadlock chamber for line-of-sight deposition. Deposition rate and thickness of material are monitored and controlled automatically. The system is fully automated with computer interface. Programmable deposition recipes are provided. |
| AJA Orion 3 Sputter Coater 2 |
|
326 MRL |
AJA sputter coater 2 is an AJA ORION 3 sputter system with three ST20 ORION magnetron sputter guns capable of sputtering conductive and dielectric materials using DC and RF Argon plasma. Co-sputtering (up to three guns, two DC and one RF power supply) is available. The system accommodates 2” targets (1/4” thick) including various materials such as Cr, Ti, Cu, Mo, Al, Ag, Pt, Pd, Mg, Ni, Fe, Co, Si, Ge, W, ITO, SiO2, Si3N4 and MgO. Sample holder size is 4” in diameter. Reactive sputtering with O2 is available. |
| AJA ATC2000 Sputter Coater 1 |
|
336 MRL |
AJA sputter coater 1 is an AJA ATC 2000 sputter system with four A320 XP UHV magnetron sputter guns capable of sputtering conductive and dielectric materials using DC and RF Argon plasma. Co-sputtering (up to three guns, two DC and one RF power supply) is available. The system accommodates 2” targets (1/4” thick) including various materials such as Cr, Ti, Cu, Mo, Al, Ag, Mg, Ni, Fe, Co, Si, Ge, W, ITO, SiO2, Si3N4 and MgO. Sample holder size is 4” in diameter. Substrate heating is available at up to 400 C. Reactive sputtering with O2 and N2 is also available. |
| Commonwealth Scientific Ion Milling & Thermal Evaporator System |
|
334 MRL |
The Commonwealth Scientific Ion Milling & Thermal Evaporator System is a unique system which integrates the ion milling and thermal evaporator capabilities into one system. |
| AJA Orion-8 Magnetron Sputtering System |
|
336 MRL |
This equipment was funded through the Illinois MRSEC, NSF Award Number DMR-2309037. The AJA Orion-8 Magnetron Sputtering System is a high performance thin film deposition tool meant to deliver maximum performance and results for our research community. The system is equipped with a fast-cycle load-lock system which eliminates the need to vent the process chamber to load substrates, reducing the pump down time and contaminations of targets and interior chamber surfaces. It utilizes a motorized rotating substrate holder to achieve excellent uniformity. This machine is featured with complete recipe control to deliver best process reproducibility. |
| Savannah S100 Atomic Layer Deposition Cambridge Nanotech |
|
326 MRL |
The Savannah S100 ALD systems deliver outstanding deposition results and provide maximum experimental flexibility for ALD research, development, and production applications. |
| Plasma-Therm Plasma Enhanced Chemical Vapor Deposition System (PECVD) |
|
342 MRL |
Plasma-Therm plasma enhanced chemical vapor deposition (PECVD) system is used for depositing Si3N4 dielectric films. The silicon nitride film is typically used for capacitor dielectrics, chemical passivation layers, electrical insulators, reactive ion etching masks, and optical anti-reflective coatings. |
| Kurt J. Lesker Nano36 Thermal Evaporator System |
|
326 MRL |
The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-sit by a thickness monitor. Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination.Currently the system is configured for Au, Ag, Cu and Cr evaporation. Due to the limited capacity of tungsten boat and rod, the thickness limit is 200nm/boat for Au, Ag, Cu, and 40nm/rod for Cr. |