Additional Micro/Nanofabrication Resources
Additional Equipment
| Equipment Name | Contact | Location | |
|---|---|---|---|
| Equipment Name | Contact | Location | |
| ADT 7122 Wafer Dicer |
|
326 MRL |
The Advanced Dicing Technology (ADT) 7122 is an automatic wafer dicer with an 8" diameter (or 200 mm x 200 mm square area) dicing area. |
| UV/Ozone Cleaner |
|
388 MRL |
Ultraviolet (UV) ozone cleaners have proven highly effective in non-acidic, dry, and non-destructive atomic cleaning processes. Utilizing intense UV light at wavelengths of 185 nm and 254 nm, they efficiently eradicate organic contaminants. The 185 nm wavelength generates ozone in the presence of oxygen, while the 254 nm wavelength activates organic molecules on surfaces. This dual mechanism swiftly destroys and eliminates organic contaminations.
|
| Logitech PM6 Precision Lapping and Polishing System with Wafer Bonding Capabilities |
|
B70 MRL |
The PM6 provides automated precision lapping and polishing capabilities for a wide variety of semiconductor, optoelectronics, microelectronics and geological applications. The system includes capabilities for wafer bonding.
|
| Optical Microscopes with CCD cameras |
|
326 MRL | |
| Jandel 4-Point Probe Sheet Resistance Measurement |
|
326 MRL |
- Automatically calculate and display sheet resistance results - Self test against external precision resistor, 100Ω - Output currents up to 99.99mA and down to 10nA - Compliance voltage up to 40V - Accuracy of the instrument within 1% across whole range. |