Logitech PM6 Precision Lapping and Polishing System with Wafer Bonding Capabilities

The PM6 Precision Lapping & Polishing system achieves results akin to those from large-scale production equipment. It also includes wafer bonding capabilities.  It offers exceptional flexibility, handling various materials, including  silicon, GaAs, rock, and soils. The system reliably produces specimens with superior quality and surface finish. Its precise plate setup features and intuitive control system ensure consistent, accurate results with minimal effort.

Key Features:

• Single Workstation: This unit accommodates wafers up to 4”/100mm. Driven jig roller arms enhance accuracy and repeatability.
• Variable Plate Speeds: Adjustable from 5 to 100 rpm, enabling faster lapping and polishing rates.
• Recipe Mode: Allows operators to create, save, and recall multi-stage process recipes for consistent results.
• Metered Abrasive Feed Unit: Equipped with peristaltic pumps, the flow rate can be set between 1-100 ml per minute, improving quality and accuracy while reducing waste and operational costs.
• Graphical User Interface (GUI): Controls all process parameters, including plate speeds, material removal rates, driven jig arm, and abrasive feed, offering complete operator control.
• Automatic Drip Detector: Stops plate rotation when abrasive cylinders are empty to prevent damage to specimens from running on a dry plate.
• Real-Time Data Collection: Bluetooth-enabled for real-time data transmission and USB port export for external analysis.
• Automatic Plate Flatness Control: Bluetooth technology ensures continuous in-situ measurement of plate flatness.