Heidelberg MLA150 aligner for maskless photolithography
This maskless process offers flexibility and economy, providing non-contact exposure and very high speed compared to mask-based processes. Full areas of 200 x 200 mm2 with features down to 1 micron can be exposed in only 36 minutes. The MLA150 aligner the MRL is equipped with two laser illumination modules (405 nm and 375 nm), feature size resolution down to 1 micro, optical autofocus for superior focus stability (in particular on surfaces smaller than 5x5 mm2), and basic gray scale exposure mode to write complex topographies. Instrument delivery, installation and available to the users is complete as of November 2019. The instrument will be located in our cleanroom as part of the micro/nanofabrication core of instrumentation in the MRL Central Research Facilities.