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Scanning Electron Microscopy (SEM)

SEM is generally used to study topography, morphology and local chemical and phase composition on the scale of nanometers to millimeters. SEM is also used to study crystallographic relationships including texture, boundary character, strain and deformation mechanisms through electron diffraction. SEM can also be used for spectroscopic study of electron beam induced light emission (cathodoluminescence) of materials at room and liquid helium temperature. SEMs at MRL include two high resolution cold field emission SEM, an analytical Schottky source SEM equipped with EDS, WDS, EBSD, CL, and a helium cold stage, and a low vacuum general purpose SEM.

SEM Equipment

Equipment Name Contact Location
Equipment Name Contact Location
JEOL JSM-6060LV Low-Vacuum SEM jcspear zyw, wswiech 0021 Supercon

The JSM-6060LV is a general purpose high-performance scanning electron microscope with excellent secondary electron imaging and backscattered electron Imaging resolution.

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Hitachi S-4700 High Resolution SEM zyw hhzhou 0018 Supercon

The Hitachi S-4700 SEM features: High Resolution Low Voltage Imaging; Centaurus BSE detector; iXRF EDS Elemental Analysis System with Oxford Instruments (Si(Li) detector, ATW2 window, 10 mm-square detection area, 138 eV Resolution at 5.9 keV, Element Detection (Be-U))

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Hitachi S-4800 High Resolution SEM jcspear hhzhou,flatt1,zyw 0013 Supercon

The Hitachi S-4800 SEM features: - High Resolution Low Voltage imaging - Beam deceleration (ultra-low landing voltages (100-500 V) for shallow surface topography) - Controlled signal mixing (combination of secondary electron and back scattered electron) - Pure BSE imaging at low voltages

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JEOL 7000F Analytical SEM zyw cqchen 0020 Supercon

The JSM-7000F SEM offers very high resolution, a multi-purpose specimen chamber, a motorized automated specimen stage, one-action specimen exchange, and ideal analytical geometry with large probe current at small probe diameter to meet the needs for high performance characterization of nanostructures using techniques including EDS, WDS, EBSD, and CL.

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