The Grainger College of Engineering
Materials Research Laboratory

Facilities News and Upcoming Equipment

Scheduled power outage affecting availability of most of tools in the MRL shared facilities during the week of October 21, 2024

Due to an upcoming scheduled power outage in parts of our MRL complex, several of our shared facilities labs will not be available on October 23, 2024 (and, in some cases, even before and/or after this day – please see details below).

All the lab facilities in the main MRL building and most labs in the basement of the Supercon building will be affected. The only labs that will not be affected and will be available to users as usual are the following:

  • Supercon building basement labs SC0022 and SC0024, which are part of the Laser and Spectroscopy Core.
  • The MRL Carver BioMaker lab covering the Supercon building basement rooms SC0014, SC0015 and SC0016. 

Since many tools require extensive preparation to shutdown and extensive recover after power returns, some tools might not be available during several days of the week of October 21. Please see here the approximate dates/times of start/end of outage for each specific tool in our shared facilities:

Outage schedule for each tool

For more updated information on tool availability please check our scheduling system or contact staff responsible for each lab directly. Please plan your work accordingly. Thank you for your patience and cooperation. Please do not hesitate to contact us should you have any questions.

RESEARCH FACILITIES NEWS:

UPCOMING TOOLS FOR THE MRL RESEARCH FACILITIES:

(1) Wavelength-dispersive x-ray fluorescence spectrometer (Rigaku Supermini 200)

The Rigaku Supermini 200 (WD-XRF) is a wavelength-dispersive x-ray fluorescence spectrometer capable of analyzing the Flourine – Uranium elemental range using a Palladium (Pd) X-ray source running at 50KV and 4mA (200 W). The energy resolution of 20-30 eV provides superior sensitivity and spectral resolution allowing for more accurate deconvolution and elemental quantification especially when compared to energy-dispersive x-ray fluorescence systems. This energy resolution is achieved using 3 analyzer crystals: LiF (200) for the Ti-U range, PET crystal for Al-Ti, and RX-26 multilayer crystal for F, Na, and Mg. Capable of running solids, liquids, and gases with a maximum sample size of 44m diameter and 33mm height. Automated measurements are facilitated by an easy to use bidirectional 12-position automatic sample changer with integrated sample spinner to improve sampling statistics.

Key features:

  • Elemental quantification for F - U range
  • Non-monochromatic Pd X-ray source at 50KV and 4mA (200W)
  • Compatible with solids, liquids, and gases (max size of 44m diameter and 30mm height)
  • High energy resolution (20-30eV) from 3 analyzer crystals; LiF, PET, and RX-26.
  • Measurements can be done in He or Vacuum.
  • Multipurpose sample holder with 30 mm mask (measuring area on sample surface) for a maximum sample size of 44 mm in outer diameter and 33 mm thickness.
  • Zr automatic primary beam filter is included to remove the Pd-K spectral lines resulting from the Pd target x-ray tube enabling the analysis of Cd, Ru, Rh, Pd, Ag, In.
  • ZSX control, measurement, and analysis software, including empirical regression analysis (5 matrix correction models), fundamental parameter analysis (bulk and thin films), automated PHA adjustment. Also, SQX software for semi-quantitative analysis with no standards required, in addition to SQX Matching Library and SQX Scatter FP Software.

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Expected availability: October 2024. X-ray analysis core, MRL.

(2) Logitech PM6 Precision Lapping and Polishing System

The PM6 Precision Lapping & Polishing system achieves results akin to those from large-scale production equipment. It offers exceptional flexibility, handling various materials, including gallium arsenide, silicon, rock, and soils. The system reliably produces specimens with superior quality and surface finish. Its precise plate setup features and intuitive control system ensure consistent, accurate results with minimal effort.

Key Features:

  • Single Workstation: This unit accommodates wafers up to 4”/100mm. Driven jig roller arms enhance accuracy and repeatability.
  • Variable Plate Speeds: Adjustable from 5 to 100 rpm, enabling faster lapping and polishing rates.
  • Recipe Mode: Allows operators to create, save, and recall multi-stage process recipes for consistent results.
  • Metered Abrasive Feed Unit: Equipped with peristaltic pumps, the flow rate can be set between 1-100 ml per minute, improving quality and accuracy while reducing waste and operational costs.
  • Graphical User Interface (GUI): Controls all process parameters, including plate speeds, material removal rates, driven jig arm, and abrasive feed, offering complete operator control.
  • Automatic Drip Detector: Stops plate rotation when abrasive cylinders are empty to prevent damage to specimens from running on a dry plate.
  • Real-Time Data Collection: Bluetooth-enabled for real-time data transmission and USB port export for external analysis.
  • Automatic Plate Flatness Control: Bluetooth technology ensures continuous in-situ measurement of plate flatness.

Expected availability: October 2024. Micro/NanoFab Core, MRL.

(3) Kurt J. Lesker 150LX Plasma Enhanced Atomic Layer Deposition System

The Kurt J. Lesker Company (KJLC) ALD150LX is an Atomic Layer Deposition (ALD) system designed specifically for advanced research and development (R&D) applications. With an emphasis on enabling and supporting innovative, cutting-edge technology at the R&D level, the ALD150LX serves not only as a stand-alone platform, but provides connectivity with additional process and analysis modules in a cluster tool configuration.  ALD150LX cluster tool connectivity eliminates unwanted atmosphere exposure between critical process and analysis steps to protect sensitive surfaces, layers and their interfaces. This connectivity includes the integration of additional ALD and analysis modules, as well as other KJLC thin film deposition technologies for multi-technique process and analysis capability and support that are second-to-none in the industry. Combined quality, flexibility and performance, as well as multi-technique process and analysis capability make the ALD150LX an innovative, best-in-class design.

Features:

  • Process wafers up to 6-inch in diameter.
  • Controllable independent substrate heater stage (up to 600oC)
  • Unique Perpendicular Flow Reactor
  • Thermal or plasma-enhanced ALD configuration
  • In-situ ellipsometry for real time thin film thickness monitoring
  • Multiple inlets for precursor delivery (up to 12 precursor sources)
  • Unique heater design on source modules 
  • control software

Typical Processes:

Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZrO2, HZO, ZnO, AZO, AIN, TiN, GaN Pt and Ru (many others available, please inquire).

Expected early fall of 2024. Micro/NanoFab Core, MRL.