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Equipment coming soon to MRL

100-kV e-beam lithography system: Raith EBPG5150

The Raith EBPG5150 Electron Beam Lithography System is an ultra- high performance e-beam writer for nanometer-scaled device fabrication. Some of the instrument features are:

  • Thermal Field Emission Gun.
  • 50 and 100 kV beam energy calibration.
  • Automatic dynamic off-axis focus, stigmation and distortion correction softwarelip>.
  • 50 MHz pattern generator, low noise 20-bit main field deflection.
  • Field size operation, variable, up to 524 μm by 524 μm at all voltages.
  • Overlay accuracy smaller than 5 nm.
  • Minimum feature size < 8 nm.
  • 155 mm by 155 mm stage travel.
  • Lambda/1024 (0.6 nm) laser interferometer resolution.
  • 2-holder Airlock with “straight through” loading design.
  • 5” Mask Holder.
  • 2x2 inch tables configured for piece-parts up to 2 mm thickness.
  • Piece-Parts Adaptor Plate for 5 inch Mask Holder = allows for several and/or odd shaped samples to be mounted.
  • Binocular microscope with X/Y stage and Z measurement to pre-align wafers and piece-parts on their holder prior to system loading.
  • System control software suite “BEAMS” on fully integrated control PC running Linux OS with Ethernet Interface.
  • System software for GDSII design file –to- GPF layout (EBPG format) conversion and fracturing.

Our system will also include an automatic aperture changer upgrade, with motorized and software automated control of system final apertures. It can save and recall multiple column alignments and lens settings. This is particularly useful for setup and execution of unattended exposure tasks. In addition, the MRL purchased the GenISys BEAMER full advanced data preparation software with Monte Carlo simulation and proximity correction packages.

Expected installation: Spring 2021, in the MRL Nano/Microfab cleanroom.

 

NanoRaman AFM-Raman/PL/TERS/TEPL with XploRA PLUS Raman Microscope from Horiba

This equipment was funded through the Illinois MRSEC, NSF Award Number DMR-1720633.

The XploRA PLUS Raman Microscope head-based tip-enhanced Raman spectroscopy (TERS) and tip enhanced photoluminescence (TEPL) from Horiba, Inc. is a fully integrated TERS/TEPL system based on SmartSPM state of the art scanning probe microscope (SPM) and XploRA Raman micro-spectrometer. It uses a feedback light source with wavelength of 1300 nm. Filters at the feedback light source and detector avoid interference from the lasers used for spectroscopy. This allows for co-localized and simultaneous TERS and atomic force microscopy (AFM) measurements with excitation wavelengths of 532 nm and 638 nm. Some of the main instrument features are:

  • Fully motorized and automated SPM feedback laser alignment.
  • Automatic cantilever to the spectroscopic laser after AFM tip exchange.
  • Motorized sample scanning stage with 10 nm step resolution and 70 x 50 mm X-Y movement range.
  • Scanning range 30 x 30 x 15 µm.
  • Conductive AFM measurement module allows low current Kelvin Probe measurements in a range of 100 fA to 10 microamperes.
  • Top-down and side spectroscopy excitation and collection allowing different measurement geometries.
  • Integrated color 5 MPixels USB camera.
  • The SPM and the optical microscope can be operated as stand-alone instruments.
  • The optical microscope is fully automated, truly confocal and capable of point and fast spectroscopic imaging.
  • Confocal Raman / PL operation with a spatial resolution of 500 nm in XY and 1.5 microns in Z.
  • In TERS / TEPL mode, spatial resolution is dictated by SPM probe diameter and can be better than 10 nm.
  • Integrated spectrometer with four automated tunable gratings (600, 1200, 1800, and 2400 gr/mm) enabling different spectral ranges and resolutions.
  • Spectral resolutions of 1.4 cm-1 (532 nm laser) and 1.2 cm-1 (638 nm laser).
  • The spectral detector is a deep-cooled, front-illuminated low-noise / high-sensitivity EMCCD detector featuring a dark current of < 0.003 e-/pixel/s and readout noise < 1 e- at 3 MHz.
  • Fully motorized, software-controlled polarization optics.
  • High efficiency filters allow Raman detection from 50 cm-1 and 60 cm-1 for the red and the green laser, respectively.

Our system will also include a photocurrent mapping module for photocurrent, photovoltage, electroluminescence applications, which provides precision voltage and current sourcing and measurement capabilities. It can act as a voltage source, a current source, a voltage meter, a current meter, an ohmmeter, and an electronic load.

Expected installation: Fall 2021, in the MRL Laser and Spectroscopy Facility Core.

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ThermoFisher Axia ChemiSEM

The Axia ChemiSEM is a new generation of scanning electron microscope, designed to provide the most efficient SEM-EDS user experience possible. Low-vacuum mode will provide several advantages when dealing with non-conductive samples; not only does it enable charge-free imaging, but it also allows an increase in the material contrast and the use of higher beam currents to perform chemical analyses.

Some of the instrument features are:

  • Thermal emission W gun.
  • Alignment-free operation.
  • Live Quantitative Elemental Mapping: A single scan generator controls both SE/BSE and X-ray acquisition, creating perfectly aligned EDS and imagery data.
  • Thermo Scientific Nav-Cam™ Navigation Camera.
  • Accelerating voltage range: 200 V – 30 kV.
  • Magnification: 5 to 1,000,000×.
  • Integrated current measurement: up to 2 μA, continuously adjustable beam current range.
  • Detectors:
    • TrueSight X EDS detector. Solid angle 13 mSr, resolution 129 eV
    • ETD: Everhart-Thornley SE detector
    • Low-vacuum SE detector (LVD), standard on LoVac model, with adjustable pressure up to 150 Pa
    • Motorized retractable backscattered electron detector that offers two different segments for more tunable contrast
  • Set of 3 apertures 200 um, 3 mm diameter.
  • Electron beam resolution:
    • High-vacuum imaging
      • 3.0 nm @ 30 kV (SE)
      • 8.0 nm @ 3 kV (SE)
    • Low-vacuum imaging
      • 3.0 nm @ 30 kV (SE)
      • 4.0 nm @ 30 kV (BSE)
      • 10 nm @ 3 kV (SE)
  • 280 mm inner width chamber.
  • Stage:
    • XY: 120x120 mm Eucentric Stage
    • Tilt: -15 to +90 degrees
    • Rotation: n x 360°
    • With ZTR axes removed:
      • Max. sample height: 128 mm
      • Max. sample weight: 10 kg
  • NT7 Holder: hosts up to 7 standard stubs (ø 12 mm), and does not require tools to mount a sample.
  • CCD IR camera for viewing sample in chamber.
  • 24'' Widescreen LCD Monitor.
  • Thermo Scientific Maps™ Software.
  • Manual user interface.
  • Remote control / imaging.
  • Workstation with Windows 10.

Expected installation: August 2021, in the MRL Supercon 0018 SEM lab.

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ThermoFisher Scientific Talos™ F200X G2 Scanning Transmission Electron Microscope (S/TEM)

The Talos F200X G2 is a 200 kV FEG Scanning Transmission Electron Microscope (S/TEM) that combines outstanding quality in high-resolution STEM and TEM imaging with high throughput EDS signal detection and 3D chemical characterization with compositional mapping. It is designed for fast, precise and quantitative characterization of nano-materials. It accelerates nano-analysis of materials based on higher data quality, faster acquisition, and simplified and automated operation. The system’s Constant-Power™ X-TWIN lens delivers outstanding optical performance to help ensure an optimal balance of contrast and resolution.

The microscope comes with numerous advanced functions and new features:

 X-FEG high-brightness electron source for high brightness, high temporal and spatial coherence.

  • Constant-Power Objective lens control stabilizes the optics while switching between various optical modes.
  • Lorentz Lens enabling imaging magnetic structures in field-free conditions.
  • The EMPAD (Electron Microscope Pixelated Array Detector) pixelated detector for acquiring the diffraction pattern in each pixel of a STEM image, with the speed of up to 1100 fps.
  • 4k x 4k Ceta™ 16M camera with Speed Enhancement provides fast frame rate imaging up to 40 fps at full frames, and 300 FPS for reduced frame size.
  • The 4D STEM software package for the Ceta™ 16M camera, synchronizes the STEM spot movement with the readout of the camera.
  • Super-X SDD EDS detection system with 4 large area crystals, and large EDS collection solid angle of 0.7 steradians for high count rate and high-resolution EDS analysis.
  • Segmented Panther STEM detector, along with HAADF detector, provides access to a large range of BF and DF STEM imaging techniques with 4k x 4k STEM image acquisition.
  • TEM Tomography, STEM Tomography, and EDS Tomography data acquisition software packages provide capability to obtain 3D structure and chemical information.
  • Inspect3D Xpress hardware and software for carrying out alignment of tomography data and subsequent ultra-fast tomographic reconstruction
  • Maps 3 S/TEM image acquisition and processing software for automatically acquiring images from a large area by shifting the CompuStage and stitching all the images into a final image.
  • Velox™ software for multi-signal simultaneous acquisition guides the typical workflow of STEM imaging, EDS acquisition and analysis, and special applications: DPC / iDPC (Differential Phase Contrast / Integrated DPC), and drift-corrected frame imaging (DCFI).
  • Align Genie fully automated software for aligning and (fine-) tuning the optics and column alignments in TEM mode.
  • AutoSTEM automated alignment software for the correction of focus and astigmatism correction in STEM mode up to 1 Mx magnification.
  • Computerized 5-axes Piezo enhanced stage ensures drift-free imaging with high sensitivity and precise sample navigation.
  • Fully computer controlled and motorized apertures whose alignments and positions are automatically recalled.
  • A new high speed, high dynamic range, damage insensitive digital Search and View Camera SmartCam replacing conventional fluorescent screen.
  • Instrument enclosure that moderates the impact from the air pressure waves, air flows, and fine temperature variations in the TEM room.
  • Probe current and STEM detector collection angles indicated in real time in TEM user interface.
  • The microscope will be installed  with column alignments at 80, 100 and 200 kV.

Specifications:

  • HRTEM line resolution:  0.10 nm
  • HRSTEM:                             0.16 nm
  • Brightness of X-FEG:       1.8 × 109 A /cm2 srad (@200kV)
  • Super-X EDS system:      4 SDD symmetric design, windowless, shutter-protected
  • Energy resolution:           ≤136 eV for Mn-Kα and 10 kcps (output)

Expected installation: Fall 2021, in the MRL B70C TEM lab.

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