Lithography Tools

  • NanoScribe 3D Printer
  • Spin Coater Systems (Headway Research): quantity 2; (Specialty Coatings): quantity 1
  • MJB3 Mask Aligner (Suss Microtech): quantity 3
  • MJB3 Stamper Tool( Suss Microtech): quantity 1
  • MJB4 Mask Aligner (Suss Microtech): quantity 1
  • Yield Engineering  HMDS Vapor Prime Oven: quantity 1
  • Yield Engineering P-I Curing Ovens: quantity 2
  • UV 365 nm Exposure System (Oriel)
  • eLine Electron Beam Lithography System

Raith eLine electron Beam Lithography System

Raith eLine EBL system is an electron beam lithography system that has a ZEISS SEM column equipped with a Thermal Field Emission electron gun. The accelerating voltage can be operated at 10 - 30kV. It is capable of patterning ultra fine features with resolution down to 10 nm in PMMA ebeam resist. It has a standard 30 μm aperture along with 7.5 up to 120 µm aperture. Standard write field size is 100 μm and ranges between 1µm to 1 mm. Field stitching error is typically less than 40 nm. Standard sample holder can accommodate up to 5” wafer. Eight sample clips can be used for smaller sample with sample size from 1 to 3 cm. GDSII CAD file is standard file format and can be converted from other CAD files such as Autocad DXF file.

Location: MRL 364
Hours of Operation: 24-hour access
Tao Shang, Ph.D.
Research Engineer, MRL 380
(217) 300-6143