Deposition Tools

Maximum deposition thickness for all E-beam systems is 300 nm. In Ebeam 3, special depositions with film thickness > 300 nm and < 1 µm may be allowed only when approved by Staff. There might be an additional surcharge in these cases.

Kurt J. Lesker nano36 Thermal Evaporator System

Brief Description:

The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-sit by a thickness monitor.

Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination.

Currently the system is configured for Au, Ag, Cu and Cr evaporation.  Due to the limited capacity of tungsten boat and rod, the thickness limit is 200nm/boat for Au, Ag, Cu, and 40nm/rod for Cr.

Features:

  • Programmable Logic controller with touch screen interface
  • Film thickness control FTC-2800 controller
  • Auto operation mode
  • Accommodate up to three thermal evaporation sources
  • Large wafer holder with diameter in 8 inch, the deposition thickness
  • variation is about 10% from the center to edge of the holder.
  • EMO protection

Location:  MRL 348
Hours of Operation: 24-hour access

Special Notes and Restrictions: You must be qualified by staff to use this tool.

This tool is reserved for the following metals: Au, Cu, Ag and Cr.

Evaporation of materials other than these requires prior authorization from MicroFab staff.

When you are done with your work, always leave the chamber under vacuum. Minimize the time the chamber is left at atmosphere.

The cooling water status and pump status should be green when you get to the machine. If not, notify MicroFab staff member. Do not proceed any further with the machine.

Contact:
Xiaoli Wang, Ph.D.
Research Engineer, MRL 380
(217) 244-0392

Manufacturer's website: 

https://www.lesker.com/newweb/vacuum_systems/deposition_systems_pvd_nano36.cfm

Plasma-Therm Plasma Enhanced Chemical Vapor Deposition System (PECVD)

Brief Description:

Plasma-Therm plasma enhanced chemical vapor deposition (PECVD) systems are used for depositing SiO2 or Si3N dielectric films. These films are typically used for capacitor dielectrics, chemical passivation layers, electrical insulators, reactive ion etching masks, and optical anti-reflective coatings.

PECVD 1: Plasma-Therm model 730-SLR with load lock chamber.

PECVD 2:  Plasma-Therm model 790 with single process chamber.

     

They are fully programmable with windows-based software, and use a 13.56 MHz RF source excitation to produce the plasma between two parallel aluminum plates. The gas is injected over the sample through a showerhead, and the samples are placed on the system holder which is heated to 250°C.

  • SiO2 is produced from SiH4/N2 2%/98%, N2O and N2.  
  • Si3N4 is produced from SiH4/N2 2%/98%, NH3 and N2.
  • SF6 plasma is used to clean the chamber between depositions.

Features:

  • Gases used: NH3, N2O, 2%SiH4/N2, N2 and SF6
  • Full computer operation
  • Standard recipes for a variety of film thicknesses
  • EMO protection

Location:  MRL 342
Hours of Operation: 24-hour access

Special Notes and Restrictions: You must be qualified by staff to use this tool.

When you are done with your work, always leave the chamber under vacuum. And never leave a dirty chamber for the next user.

Contact: Xiaoli Wang, Ph.D.
Research Engineer, MRL 380
(217) 244-0392

Manufacturer's website: 
http://www.plasma-therm.com/pecvd.html

Report any incidents to microFab staff (microfabstaff@mrl.illinois.edu) immediately. In case of emergency, evacuate and call 911.

Orion-8Magnetron Sputtering System

Brief Description:

The AJA Orion-8 Magnetron Sputtering System is a high performance thin film deposition tool meant to deliver maximum performance and results for our research community. The system is equipped with a fast-cycle load-lock system which eliminates the need to vent the process chamber to load substrates, reducing the pump down time and contaminations of targets and interior chamber surfaces. It utilize a motorized rotating substrate holder to achieve excellent uniformity. It’s featured with complete recipe control to deliver best process reproducibility.

Orion-8 Magnetron Sputtering System
Orion-8 Magnetron Sputtering System

Features:

  • 7 two-inch sputter sources. They are Au, Al, Ag, Ti, Cu, Cr, Mo.
  • Capable of co-sputtering of up to 4 sources.
  • Capable of both RF and DC sputtering.
  • Accommodates up to 4-inch wafer size sample.
  • Film uniformity better than +/- 2.5% over a 4-inch diameter wafer.
  • Capable of heating samples up to 850 Celsius.
  • Load-lock system to enable fast sample loading and unloading.
  • Fully automated recipe-control deposition processes.

Location:  MRL 326
Hours of Operation: 24-hour access
Contact:
Fubo Rao, Ph.D.
Research Engineer, MRL 380
(217) 244-6202