Clean Room Wet Processing

Wet processing is supported by two cleanroom fume hoods and two cleanroom flow benches.

Acid Fume Hood
Metal Etchant Fume Hood
Solvent and Developer Flow Bench

Acid Fume Hood

MicroFab provides the following acids for cleanroom users. This fume hood includes DI water, nitrogen gun and hot plate.

Chemicals

  • Hydrochloric Acid (HCl)
  • Hydrofluoric Acid (HF)
  • Buffered Oxide Etch (BOE)
  • Nano-strip (replacment for piranha)
  • Nitric Acid (HNO3)
  • Phosphoric Acid (HP3O4)

Processes

Etching of dielectrics: 

  • Etching of SiOin BOE or HF
  • Etching of Si3N4 in HP3O4
  • Thin film etching of TiO2, Al2O3 and HFO2 in HF mixture

Etching of metals:

  • Etching of AL in HNO3 and HP3O4 mixture
  • Etching in Ni in HNO3

Surface Cleaning:

  • Nanostrip is used to remove organic residues from sustrates.

NOTE: a separate safety training must be completed before using this fume hood.

Metal Etchant Fume Hood

MicroFab provides the following metal etchants for cleanroom users:

  • CU Etchant CE-100
  • Chromium Etchant 9057
  • Iron Oxide Mask Etchant ME-9028
  • Gold Etchant Type TFA

Solvent Developer Flow Bench

MicroFab provides the following solvents and developers for cleanroom users. The flow bench includes DI water, nigrogen gun, ultrasonic bath and hot plate.

Chemicals:

  • Acetone
  • IPA
  • SU-8 Developer
  • AZ 400T
  • AZ 400K Developer
  • AZ 917 MIF Developer

Processes:

Surface Cleaning:

  • Cleaning sample with acetone and IPA

Wet Photoresist stripping

  • Photoresist stripping in acetone
  • Photoresist stripping in AZ 400T stripper.

Contact:
Xiaoli Wang, Ph.D.
Research Engineer, MRL 380
(217) 244-0392