Focused Ion Beam (FIB)

Instrumentation for FIB:

Background

FIB is a combination of a high-resolution field emission scanning electron microscope (FE-SEM) and a scanning metal ion beam microscope. It provides significant new capabilities for microscopic imaging, nanofabrication, and site-selective TEM sample preparation. 

MRL Scanning Electron Microscopy (SEM) Information

FEI Helios 600i DualBeam SEM/FIB

Staff Contacts:

Honghui Zhou
404 MRL

Jim Mabon
372 MRL

Location

B58 Materials Research Laboratory

General:

The Helios NanoLab 600i is an advanced SEM/FIB DualBeam™ workstation for ultra-high resolution imaging and focussed Ga+ ion beam milling for nano-prototyping, nano-machining, nano-analysis, and sample preparation for TEM and atom probe.

Features:

  • Schottky Field Emission Cathode and UHR electron column ( Elstar) with dual mode, magnetic immersion and field free, objective lens with electrostatic scanning,
  • Sub-nanometer SEM resolution at higher beam energies and 1.4 nm@1 kV
  • Standard E-T SE detector and in-lens SE and BSE with high-angle collection
  • A high sensitivity, retractable solid-state directional backscattered detector (DBS) for high angle BSE‘s.
  • STEM detector for both bright and dark-field imaging transmitted electron imaging (0.8 nm at 30 kV).
  • Beam deceleration mode for low landing energies and imaging with sample bias up to 4kV. Highly sensitive large angle backscattered electron detection with the DBS detector.
  • High-resolution (field emission) ion optics (Tomahawk™ column), featuring a two-stage differential pumping and time of flight correction enabling fine high-accuracy FIB milling, deposition and etching.  Beam currents up to 65 nA for rapid milling.  Resolution down to 4.0nm at 0.1 pA @ 30 kV.  Operation down to 500V for near damage free cleaning. 
  • High performance Ion Conversion and Electron (ICE) detector for secondary ions (SI) and electrons (SE)
  • Platinum deposition Gas Injection Systems for EBID and IBID
  • FIB charge neutralizer (low energy electron flood source) for milling non-conductors
  • High-precision specimen piezo goniometer stage with 150 mm travel along the x and y axes.
  • IR camera for viewing sample/column, Optical color Nav-Cam for sample navigation.
  • Integrated plasma cleaner, and CryoCleaner LN2 contamination trap
  • A high-resolution, 16-bit digital patterning engine capable of Simultaneous Pattern and Imaging (iSPI™)
  • Integrated Real Time Monitor (iRTM) of milling image
  • OmniProbe AutoProbe™ 200 in-situ nano-manipulatorand sample lift-out system with 10 nm positioning resolutionallows the preparation of site specific TEM samples.
  • AutoTEM software for automated milling of TEM lamellae.
  • Auto Slice and View Basic for serial sectioning and imaging.
  • Amira Software for 3D reconstruction of serial sections.
  • iFast Developers Tool Kit (programming automation)TM 600

FEI Strata DualBeam 235 SEM/FIB

Staff Contacts:

Honghui Zhou
404 MRL

Jim Mabon
372 MRL

Wacek Swiech
306 MRL

Location
B62 Materials Research Laboratory (217) 244-5465

Features:

Microscopic Imaging
The electron column is equipped with a Schottky thermal field emission gun that provides a resolution < 2.5 nm for accelerating voltages between 0.2 to 30 keV. The up to 30 keV ion column with a gallium metal ion source provides currents ranging from 1 pA to 22 nA.  In ion beam imaging (secondary electrons) the resolution is 7 nm @ 1 pA beam current. The concurrent use of the ion and electron microscopes has a synergistic effect and significantly expands the capabilities of both.

Nanofabrication
The DB-FIB is a fabrication tool with which researchers can build devices on a nanoscale. Using the Ga ion beam one can remove material (etch) from the surface in a controlled pattern. Furthermore, using electron or ion beam assisted CVD, it is possible to selectively deposit platinum metal with line-widths down to several nanometers. The dimension of the lines can be further controlled by selective removal/etching with the ion beams.

TEM Sample Preparation
The combination of high-resolution imaging with controlled etching allows the user to identify areas of interest on a sample and prepare site specific cross-sectional or plan view TEM samples. An in-situ micromanipulator allows the TEM sample to be extracted, mounted and thinned on a grid for analysis in the TEM.