Scanning Electron Microscopy (SEM)

Instrumentation for SEM

Background

SEM is generally used to study topography, morphology and local chemical and phase composition on nanometers to millimeters scale.  SEM is also used to study crystallographic relationships including texture, boundary character, strain and deformation mechanisms through electron diffraction.   SEM can also be used for spectroscopic study of electron beam induced light emission (cathodoluminescence) of materials at room and liquid helium temperature. SEMs at MRL include two high resolution cold field emission SEM, an analytical Schottky source SEM equipped with EDS, WDS, EBSD, CL, and a helium cold stage, and a low vacuum general purpose SEM. .

JEOL 7000F Analytical SEM

Staff Contacts:

Jim Mabon
372 MRL

CQ Chen
402 MRL

Location
0020 Materials Research Laboratory
(217) 333-4265

General

The JSM-7000F SEM offers very high resolution, a multi-purpose specimen chamber, a motorized automated specimen stage, one-action specimen exchange, and ideal analytical geometry with large probe current at small probe diameter to meet the needs for high performance characterization of nano-structures using techniques including EDS, WDS, EBSD, and CL.

Analytical Accessories

  • Thermo Electron EDS and WDS X-ray Microanalysis System with atmospheric thin window EDS detector and high performance WDS parallel beam spectrometer with hybrid X-ray optics
  • HKL Technology EBSD System with high resolution camera for crystallographic measurements, high speed texture mapping, and phase identification. Forward Scatter Detector for crystallographic contrast imaging
  • Gatan MonoCL3 Cathodoluminesence(CL) Spectrometer and imaging system for 300-1700nm. Liquid He Cooled stage module

Major Specifications

  • Resolution 1.2nm (30kV) , 1.5 nm (15kV), 3.0 nm (1kV) imaging performance 3.0 nm (15 kV, 10 mm, 5nA) for high resolution analytical performance
  • Accelerating Voltage 0.5 to 30 kV
  • Electron Source Schottky Field Emission Gun
  • Probe Current <1 pA to >200nA
  • Magnification x10 to 500,000
  • Image Modes Secondary Electron Image, Backscattered Electron Image (Composition, Topography), Forward Scatter detector (EBSD), Cathodoluminesence
  • Accessory Ports 11 ports with optimized geometry for analytical detectors Specimen Stage Eucentric goniometer (5 axis motorized) X=70mm, Y=50mm, Z=3 to 41 mm, R=360° (endless) T=-5 to 70°
  • Image Store Up to 2560 x 2048 pixels Analytical Working Distance 10mm EDS 15mm WDS 

Hitachi S-4800 High Resolution SEM

Staff Contacts:

Jade (Zhiyu) Wang
256 MRL

Honghui Zhou
404 MRL

Jim Mabon
372 MRL

Location
0013 Materials Research Laboratory

Capabilities

  • High Resolution Low Voltage imaging
      1.0 nm resolution at 15 kV, WD=4mm
      1.4 nm resolution at 1 kV, WD=1.5nm, Deceleration mode
      2.0 nm resolution at 1 kV, WD=1.5mm, Normal mode
  • Beam deceleration (ultra-low landing voltages (100-500 V) for shallow surface topography)
  • Controlled signal mixing (combination of secondary electron and back scattered electron)
  • Pure BSE imaging at low voltages

Hitachi S-4700 High Resolution SEM

Staff Contacts:

Jade (Zhiyu) Wang
256 MRL

Honghui Zhou
404 MRL

Jim Mabon
372 MRL

Location

0018 Materials Research Laboratory

Capabilities

  • High Resolution Low Voltage Imaging
      2.5 nm resolution at 1 kV
      1.5 nm resolution at 15 kV
  • Centaurus BSE detector
  • iXRF EDS Elemental Analysis System with Oxford Instruments  (Si(Li) detector, ATW2 window, 10 mm2 detection Area, 138 eV Resolution at 5.9 keV, Element Detection (Be-U)) 

JEOL JSM-6060LV Low Vacuum Scanning Electron Microscope

Staff Contacts:

Jade (Zhiyu) Wang
256 MRL

Jim Mabon
372 MRL

Wacek Swiech
306 MRL

Location
0021 Materials Research Laboratory
(217) 333-4265

General
The JSM-6060LV is a general purpose high-performance scanning electron microscope with excellent secondary electron imaging and backscattered electron Imaging resolution. The intuitive PC interface allows the instrument to be easily operated by novices after a relatively short introduction to SEM and training session, along with some subsequent practice. The specimen chamber can accommodate a specimen of up to 5 inches in diameter. Operation training emphasizes "manual" operation and optimizing alignment and operating parameters, rather than automated functions, to facilitate better understanding of the basic theory of operation. As the user develops skills, this also helps insure optimal images are obtained. The fully automatic Low Vacuum (variable pressure) mode allows for observation of specimens that cannot be viewed at high vacuum because of a nonconductive surface or excessive water content. In addition to an X-ray microanalysis system, it can also perform basic EBIC imaging.

Major Specifications

  • Resolution 
    High Vacuum mode: 3.5nm (30 kV, 6mm WD)
    Low Vacuum mode: 4.0nm (30 kV, 6mm WD)
  • Accelerating Voltage
    0.5 to 30 kV (53 steps)
  • Electron Source
    Pre-centered W hairpin filament
  • Probe Current
    1 pA to ~1000nA
  • Magnification
    x5(48 mm WD) to 300,000 (149 steps)
  • Image Modes
    Secondary Electron Image Backscattered Electron Image (Composition, Topography, and Shadow), solid state type detectors
  • Objective Lens
    Conical lens, WD 6 to 48 mm
  • Objective Aperture
    30 micron, manually centered with OL wobbler
  • Specimen Stage
    Eucentric goniometer, X=80mm, Y=40mm, Z=5 to 48mm, R=360° (endless), T=-10 to 90°
  • Image Store
    1280 x 960 pixels
  • Analytical Working Distance
    10mm for EDS and Standard Operation
  • Vacuum Mode Changeover
    Automatic (PC interface controlled)
    LV mode (10 - 270 Pa)
    LV Detecter: BEI (all modes)
  • Energy Dispersive X-ray Microanalysis 
    iXRF EDS Elemental Analysis System
    10 mm2 ATW Oxford Instruments Si(Li) X-ray Detector
    130 eV resolution (Mn K-alpha)
    Light Element Detection (Be-U)
    Sensitivities typically (0.1% - 1%)
    Qualitative Analysis
    Quantitative Analysis (excluding light elements and with certain limitations and requirements)
    Digital X-ray Mapping and Imaging, X-ray Linescans