Surface and Thin Film Analysis Workshop

Conference Flyer
Conference Flyer

New Developments and Applications of TOF-SIMS, SAM, and XPS for Surface and Thin Film Analysis, April 17, 2008 9am-5pm
Hosted by The Frederick Seitz Materials Research Laboratory, University of Illinois

In this one day workshop we will describe the analytical capabilities and applications of the three most widely used surface analysis techniques; Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS); Scanning Auger Microscopy (SAM); and X-ray Photoelectron Spectroscopy (XPS). For each of the three techniques, the basic principles will be described followed by a more detailed discussion of recent applications on materials of significance in today's research environment. After this, instrument tours and demonstrations will be offered on the surface analysis instrumentation available in the Center for Microanalysis of Materials at the University of Illinois.

Time-of-Flight SIMS (TOF-SIMS)
TOF-SIMS has developed into one of the most important techniques for surface and thin film characterization in recent years. The TOF-SIMS technique has several advantages for thin film analysis, including; 1) parallel detection of all elements; 2) high mass resolution; 3) trace level sensitivity; 4) submicron spatial resolution; and 5) sub nm depth resolution. One of the most important applications of TOF-SIMS is for imaging molecules at the surface with submicron spatial resolution. Important applications include molecular analysis of biological tissues, biomaterials, and polymers, as well as trace elemental analysis of semiconductors, ceramics, and glass.

Scanning Auger Microscopy (SAM)
SAM is a tool most often used when high spatial resolution compositional information is required for problem solving, materials characterization and failure analysis. Modern Auger instrumentation combines a field emission electron source, a high performance electron energy analyzer, parallel electron detection and complete computer control to provide efficient and straight-forward analysis of complex materials and structures. Included in this talk will be a discussion of the instrumentation with examples of typical Auger studies. These examples will illustrate the use AES at high spatial resolution and for chemical state analysis. Examples will include an in-situ steel fracture analysis, semiconductor device characterization, and defect analysis.

X-ray Photoelectron Spectroscopy (XPS)
XPS is the most widely used of all surface analysis techniques. This is due to its ability to quantitatively measure the surface composition of both insulating and conducting materials. The sample is irradiated with mono-energetic x-rays causing photoelectrons to be emitted from the sample surface. From the binding energy and intensity of a photoelectron peak, the elemental identity, chemical state, and quantity of an element are determined. XPS provides chemical state information about bonding of atoms at the surface. The information XPS provides about surface layers or thin film structures is of value in many areas of materials research, including; polymer surface modification, catalysis, corrosion, adhesion, semiconductor and dielectric materials, electronics packaging, magnetic media, and thin film coatings.

About the Presenters:
Scott Bryan
Scott has been at PHI for 14 years, specializing in the development and applications of TOF-SIMS. He works with scientists in a wide range of industries exploring the analytical capabilities of TOF-SIMS. Prior to joining PHI in 1993, he spent 7 years as manager of the surface analysis group at the Corporate Research Center for BP America with responsibility for Auger, XPS, and SIMS. His educational background includes a BS degree in Chemistry from the University of Minnesota and a Ph.D. in Analytical Chemistry from the University of North Carolina.

Dennis Paul
Denny has been at PHI for 34 years, specializing in the development of SAM. He has worked on the development and applications of every generation of Auger instrument. In addition to working in the MN lab for PHI, he spent 3 years working at the PHI lab in Munich, Germany. Prior to joining PHI, he received a BS degree in Biology from Winona State University.

Seminars will be at 190 ESB
Tours and demos will be at the CMM


Demonstrations of the surface analysis instrumentation available in the Center for Microanalysis of Materials at the University of Illinois will occur following the workshop lectures. Demos will cover practical aspects of analysis of common samples with on-site real time data collection and quantification. The demos will be primarily offered to registered participants that are from outside campus. Sign up is required and space is limited. When filling out the registration form, participants are required to select the techniques of interest for demo.


Presented and sponsored by:

Physical Electronics logo