Micro/Nano Fabrication and Cleanroom
Easy to use the Karl Suss MJB-4 is the perfect system for research and small laboratories.
The MJB-4 offers flexibility in the handling of irregularly shaped substrates and pieces of differing thicknesses, as well as standard size wafers up to 3 inches in diameter. Equipped with a reliable, high precision alignment and high resolution printing capability in the sub-micron range, the MJB-4 offers a performance unsurpassed by any comparable aligner
High resolution printing down to .05 microns
The Karl Suss MJB-3 Mask Aligner is designed for high resolution photolithography. The MJB-3 offers flexibility in the handling of irregular shaped substrates and pieces of differing thickness, as well as mask sizes of 3x3 inches. Geometries as small as 1.5 microns can be achieved using the 365 Nanometer wavelength illumination.
The next generation 3D laser lithography system, MRL’s Nanoscribe sets new standards in 3D micro printing and maskless lithography. It combines two writing modes in one device: an ultra-precise piezo mode for arbitrary 3D trajectories and the high-speed galvo mode for fastest structuring in a layer-by-layer fashion.
Lithography uses light or electron beam to produce specific patterns on substrates during device fabrication. Photo- and electron-beam lithography facilities are available in the MRL through a series of mask aligners, stampers, ovens, two-photon sub-micron lithography 3D printing and an electron-beam lithography system.
MicroFab provides the following solvents and developers for cleanroom users. The flow bench includes DI water, nitrogen gun, ultrasonic bath and hot plate.
- SU-8 Developer
- AZ 400T
- AZ 400K Developer
- AZ 917 MIF Developer
MRL provides the following metal etchants for cleanroom users:
- Copper Etchant CE-100
- Chromium Etchant 9057
- Iron Oxide Mask Etchant ME-9028
- Gold Etchant Type TFA
NOTE: A separate safety training must be completed before using this fume hood.
MRL provides the following acids for cleanroom users. This fume hood includes DI water, nitrogen gun and hot plate.
- Hydrochloric Acid (HCl)Hydrofluoric Acid (HF)
- Buffered Oxide Etch (BOE)
- Nano-strip (replacment for piranha)
- Nitric Acid (HNO3)
- Phosphoric Acid (HP3O4)
Etching of dielectrics:
- Etching of SiO2in BOE or HF
- Etching of Si3N4in HP3O4
- Thin film etching of TiO2, Al2O3and HFO2in HF mixture
Etching of metals: